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2016-04-01 1 2016-04-01 silicon npn phototransistor version 1.3 sfh 3400 ordering information features: ? spectral range of sensitivity: (typ) 460 ... 1080 nm ? package: smart dil ? special: high linearity ? available only on tape and reel ? the product qualification test plan is based on the guidelines of aec-q101-rev-c, stress test qualific ation for automotive grade discrete semiconductors. applications ? photointerrupters ? industrial electronics ? for control and drive circuits ? ambient light detector type: photocurrent ordering code i pce [a] = 950 nm, e e = 0.1 mw/cm 2 , v ce = 5 v sfh 3400 63 ... 320 q65110a2629 sfh 3400-2/3 100 ... 320 q65110a2634
2016-04-01 2 version 1.3 sfh 3400 maximum ratings (t a = 25 c) characteristics (t a = 25 c) parameter symbol values unit operating and storage temperature range t op ; t stg -40 ... 100 c collector-emitter voltage v ce 20 v collector-emitter voltage (t < 2 min) v ce 70 v collector current i c 50 ma collector surge current ( < 10 s) i cs 100 ma emitter-collector voltage v ec 7 v total power dissipation p tot 120 mw esd withstand voltage (acc. to ansi/ esda/ jedec js-001 - hbm) v esd 2000 v thermal resistance for mounting on pcb r thja 450 k/w parameter symbol values unit wavelength of max. sensitivity (typ) s max 850 nm spectral range of sensitivity (typ) 10% (typ) 460 ... 1080 nm radiant sensitive area (typ) a 0.55 mm 2 dimensions of chip area (typ) l x w (typ) 1 x 1 mm x mm half angle (typ) ? 60 capacitance (v ce = 5 v, f = 1 mhz, e = 0) (typ) c ce 10 pf dark current (v ce = 10 v, e = 0) (typ (max)) i ce0 3 ( 100) na
version 1.3 sfh 3400 2016-04-01 3 grouping (t a = 25 c, = 950 nm) group min photocurrent max photocurrent typ photocurrent rise and fall time e e = 0.1 mw/cm 2 , v ce = 5 v e e = 0.1 mw/cm 2 , v ce = 5 v e v = 1000 lx, std. light a, v ce = 5 v i c = 1 ma, v cc = 5 v, r l = 1 k? i pce, min [a] i pce, max [a] i pce [a] t r , t f [s] sfh 3400-1 63 125 1650 16 sfh 3400-2 100 200 2600 24 sfh 3400-3 160 320 4200 34 group collector-emitter saturation voltage i c = i pcemin x 0.3, e e = 0.1 mw/cm 2 v cesat [mv] sfh 3400-1 170 sfh 3400-2 170 sfh 3400-3 170 note.: i pcemin is the min. photocurrent of the specified group. relative spectral sensitivity 1) page 12 s rel = f() photocurrent 1) page 12 i pce = f(e e ), v ce = 5 v ohf02332 0 rel s 400 10 20 30 40 50 60 70 80 % 100 500 600 700 800 900 nm 1100 e ohf00326 e -3 10 pce -4 10 10 1 ma 2 mw/cm 10 -2 10 0 10 -3 10 -2 10 -1 0 10 12 3
2016-04-01 4 version 1.3 sfh 3400 photocurrent 1) page 12 i pce = f(v ce ), e e = parameter photocurrent 1) page 12 i pce / i pce (25c) = f(t a ), v ce = 5 v dark current 1) page 12 i ceo = f(v ce ), e = 0 dark current 1) page 12 i ceo = f(t a ), e = 0 v ohf00327 ce 0 0 10 20 30 40 50 60 70 v ma pce 1.0 mw/cm 0.5 1.0 1.5 2.0 2.5 3.0 2 2 0.5 mw/cm 0.25 mw/cm 2 0.1 mw/cm 2 ohf05720 0 ?c a t 0 (25 ?c) i pce i pce 25 50 75 100 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.8 v ohf02341 ce 0 ceo -2 10 10 -1 10 0 10 1 10 2 na 10 20 30 40 50 70 v ohf05721 a t 10 0 10 1 10 2 10 3 10 -1 ?c 0 20 40 60 80 100 ceo i na
version 1.3 sfh 3400 2016-04-01 5 collector-emitter capacitance 1) page 12 c ce = f(v ce ), f = 1 mhz, e = 0 power consumption p tot = f(t a ) directional characteristics 1) page 12 s rel = f(?) v ohf02344 ce ce c 0 10 -2 -1 10 0 10 1 10 10 2 v pf 5 10 15 20 t ohfd0228 a 0 tot p 0 20 40 60 80 c 100 mw 20 40 60 80 100 120 140 ohf01402 90 80 70 60 50 40 30 20 10 20 40 60 80 100 120 0.4 0.6 0.8 1.0 ? 0.2 0.4 0.6 0.8 1.0 100 0 0 0
2016-04-01 6 version 1.3 sfh 3400 pinning package outline dimensions in mm (inch). pin description 1 collector 2 n.c. 3 emitter package smart dil approximate weight: 12 mg
version 1.3 sfh 3400 2016-04-01 7 recommended solder pad reflow soldering profile product complies to msl level 4 acc. to jedec j-std -020d.01 0 0 s oha04525 50 100 150 200 250 300 50 100 150 200 250 300 t t ?c s t t p t t p 240 ?c 217 ?c 245 ?c 25 ?c l
2016-04-01 8 version 1.3 sfh 3400 taping dimensions in mm (inch). oha04612 profile featureprofil-charakteristik ramp-up rate to preheat* ) 25 c to 150 c 2 3 k/s time t s t smin to t smax t s t l t p t l t p 100 120 60 10 20 30 80 100 217 2 3 245 260 3 6 time25 c to t p time within 5 c of the specified peaktemperature t p - 5 k ramp-down rate*t p to 100 c all temperatures refer to the center of the package, measured on the top of the component* slope calculation d t/ d t: d t max. 5 s; fulfillment for the whole t-range ramp-up rate to peak* ) t smax to t p liquidus temperaturepeak temperature time above liquidus temperature symbolsymbol uniteinheit pb-free (snagcu) assembly minimum maximum recommendation k/sk/s s ss s c c 480
version 1.3 sfh 3400 2016-04-01 9 tape dimensions [mm] tape dim ensions in m m reel dimensions [mm] reel dim ensions in m m barcode-product-label (bpl) tape and reel 12 mm tape with 2000 pcs. on ? 180 mm reel w p 0 p 1 p 2 d 0 e f 12 + 0.3 / - 0.1 4 0.1 4 0.1 or 8 0.1 2 0.05 1.5 0.1 1.75 0.1 5.5 0.05 a w n min w 1 w 2max 180 12 60 12.4 + 2 18.4 d 0 2 p p 0 1 p w f e direction of unreeling n w 1 2 w a ohay0324 label leader: trailer: 13.0 direction of unreeling 0.25 min. 160 mm * min. 400 mm * *) dimensions acc. to iec 60286-3; eia 481-d oha04563 (g) group: 1234567890 (1t) lot no: (9d) d/c: 1234 (x) prod no: 123456789 (6p) batch no: 1234567890 lx xxxx rohs compliant bin1: xx-xx-x-xxx-x ml x temp st xxx c x pack: rxx demy xxx x_x123_1234.1234 x 9999 (q)qty: semiconductors osram opto xx-xx-x-x example x_x123_1234.1234 x x_x123_1234.1234 x example example example xxx xxx x_x123_1234.1234 x x_x123_1234.1234 x xx-xx-x-x xx-xx-x-x example example example example example example example xxx xxx x_x123_1234.1234 x x_x123_1234.1234 x xx-xx-x-x xx-xx-x-x example pack: rxx xxx x_x123_1234.1234 x x_x123_1234.1234 x xx-xx-x-x example pack: rxx pack: rxx demy demy example 1234 1234 example example example example example example example example example (9d) d/c: (9d) d/c: 1234 1234 example example example example example 1234 example pack: rxx pack: rxx demy example example example example example (9d) d/c: (9d) d/c: example example example example (9d) d/c: (9d) d/c: 1234 example example example example (9d) d/c: example example example example example example example example example example example example example example example example example example example example example 1234567890 1234567890 example example example example example example example example example example example example example example example example example example example example example example (6p) batch no: (6p) batch no: 1234567890 1234567890 semiconductors semiconductors example example example example example example example example example (6p) batch no: (6p) batch no: 1234567890 1234567890 example semiconductors semiconductors osram opto osram opto example example 1234567890 x_x123_1234.1234 x pack: rxx demy x_x123_1234.1234 x (9d) d/c: 1234 (9d) d/c: 1234567890 (6p) batch no: 1234567890 osram opto xxx x_x123_1234.1234 x xx-xx-x-x pack: rxx demy semiconductors
2016-04-01 10 version 1.3 sfh 3400 dry packing process and materials note: moisture-sensitive product is packed in a dry bag c ontaining desiccant and a humidity card. regarding dry pack you will find further informatio n in the internet. here you will also find the norm ative references like jedec. transportation packing and materials dimensions of transportation box in mm width length height 195 5 195 5 30 5 oha00539 osram moisture-sensitive label or print barcode label desiccant humidity indicator barcode label osram please check the hic immidiately after bag opening. discard if circles overrun. avoid metal contact. wet do not eat. comparatorcheck dot parts still adequately dry.examine units, if necessary examine units, if necessary 5% 15% 10% bake unitsbake units if wet, change desiccantif wet, humidity indicator mil-i-8835 if wet, moisture level 3 floor time 168 hours moisture level 6 floor time 6 hours a) humidity indicator card is > 10% when read at 23 ?c 5 ?c, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. after this bag is opened, devices that will be subjected to infrared 1. shelf life in sealed bag: 24 months at < 40 ?c and < 90% relative humidity (rh). moisture level 5a at factory conditions of (if blank, seal date is identical with date code). a) mounted withinb) stored at body temp. 3. devices require baking, before mounting, if:bag seal date moisture level 1 moisture level 2 moisture level 2a 4. if baking is required, b) 2a or 2b is not met. date and time opened: reference ipc/jedec j-std-033 for bake procedure. floor time see below if blank, see bar code label floor time > 1 yearfloor time 1 year floor time 4 weeks 10% rh. _ < moisture level 4moisture level 5 ?c). opto semiconductors moisture sensitive this bag contains caution floor time 72 hoursfloor time 48 hours floor time 24 hours 30 ?c/60% rh. _ < level if blank, seebar code label oha02044 packvar: r077 additional text p-1+q-1 multi topled muster osram opto semiconductors (6p) batch no: (x) prod no: 1 0 (9d) d/c: 11 (1t) lot no: 210021998 123gh1234 0 24 5 (q)qty: 2000 0144 (g) group: 260 c rt 240 c r 3 220 c r ml bin3: bin2: q-1-20 bin1: p-1-20 lsy t676 22a temp st r18 demy packvar: r077 additional text p-1+q-1 multi topled muster osram opto semiconductors (6p) batch no: (x) prod no: 1 0 (9d) d/c: 1 1 (1t) lot no: 210021998 123gh1234 0 2 4 5 (q)qty: 2000 0144 (g) group: 260 c rt 240 c r 3 220 c r ml bin3: bin2: q-1-20 bin1: p-1-20 lsy t676 22a temp st r18 demy osram packingsealing label barcode label moisture level 3 floor time 168 hours moisture level 6 floor time 6 hours a) humidity indicator card is > 10% when read at 23 ?c 5 ?c, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. after this bag is opened, devices that will be subjected to infrared 1. shelf life in sealed bag: 24 months at < 40 ?c and < 90% relative humidity (rh). moisture level 5a at factory conditions of (if blank, seal date is identical with date code). a) mounted withinb) stored at body temp. 3. devices require baking, before mounting, if:bag seal date moisture level 1 moisture level 2moisture level 2a 4. if baking is required, b) 2a or 2b is not met. date and time opened: reference ipc/jedec j-std-033 for bake procedure. floor time see below if blank, see bar code label floor time > 1 yearfloor time 1 year floor time 4 weeks 10% rh. _ < moisture level 4moisture level 5 ?c). opto semiconductors moisture sensitive this bag contains caution floor time 72 hoursfloor time 48 hours floor time 24 hours 30 ?c/60% rh. _ < level if blank, seebar code label barcode label
version 1.3 sfh 3400 2016-04-01 11 disclaimer language english will prevail in case of any discre pancies or deviations between the two language word ings. attention please! the information describes the type of component and shall not be considered as assured characteristics . terms of delivery and rights to change design reser ved. due to technical requirements components may c ontain dangerous substances. for information on the types in question please con tact our sales organization. if printed or downloaded, please find the latest ve rsion in the internet. packing please use the recycling operators known to you. we can also help you C get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of transport . for packing material that is returned to us unsorted or which w e are not obliged to accept, we shall have to invoi ce you for any costs incurred. components used in life-support devices or systems must be expressly authorized for such purpose! critical components* may only be used in life-suppo rt devices** or systems with the express written ap proval of osram os. *) a critical component is a component used in a li fe-support device or system whose failure can reaso nably be expected to cause the failure of that life-support device or system, or to affect its safety or the ef fectiveness of that device or system. **) life support devices or systems are intended (a ) to be implanted in the human body, or (b) to supp ort and/or maintain and sustain human life. if they fail, it i s reasonable to assume that the health and the life of the user may be endangered.
2016-04-01 12 version 1.3 sfh 3400 glossary 1) typical values: due to the special conditions of the manufacturing processes of led, the typical data or calculated correlations of technical parameters can only reflect statistical figures. these do not nec essarily correspond to the actual parameters of each single product, which could differ from the typical data a nd calculated correlations or the typical characteristic line. if requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
2016-04-01 13 version 1.3 sfh 3400 published by osram opto semiconductors gmbh leibnizstra?e 4, d-93055 regensburg www.osram-os.com ? all rights reserved.

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